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Thermal Fatigue and Failure Analysis of Cu-Plated Through Hole Solder Joints
Susan, DF, Kilgo, AC, Vianco, PT, Neilsen, MKVolume:
15
Language:
english
Journal:
Microscopy and Microanalysis
DOI:
10.1017/s1431927609093039
Date:
July, 2009
File:
PDF, 476 KB
english, 2009