The Formation of TiN-Encapsulated Cu Interconnects

MRS Proceedings 1992 / 1 Vol. 260

The Formation of TiN-Encapsulated Cu Interconnects

Li, Jian, Strane, J. W., Russell, S. W., Chapman, P., Shacham-Diamand, Y., Mayer, J. W.
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Volume:
260
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-260-605
Date:
January, 1992
File:
PDF, 826 KB
english, 1992
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