Improvement of Wafer Edge Profile and Cmp Performance...

MRS Proceedings 2000 / 1 Vol. 613

Improvement of Wafer Edge Profile and Cmp Performance Through The Floating Head Design

Wang, Huey-Ming, Moloney, Gerry, Stella, Mario, Deguzman, Sesinando
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Volume:
613
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-613-e5.1.1
Date:
January, 2000
File:
PDF, 79 KB
english, 2000
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