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Characterization of Electrodeposited Copper Films with Time-of-Flight SIMS
Demers, H, Emekli, U, Lifshin, E, West, ACVolume:
15
Journal:
Microscopy and Microanalysis
DOI:
10.1017/s143192760909607x
Date:
July, 2009
File:
PDF, 833 KB
2009