Beware of Artifacts When Characterizing Nanometer Device Features Smaller than a TEM Lamella Thickness in Semiconductor Wafer-foundries
Zhao, Wayne, Porter, Hugh, Rai, Raghaw, Chen, Esther (PY), Russell, JeremyVolume:
20
Language:
english
Journal:
Microscopy and Microanalysis
DOI:
10.1017/s1431927614006722
Date:
August, 2014
File:
PDF, 1.53 MB
english, 2014