![](/img/cover-not-exists.png)
Relaxation of Thermal Stress by Dislocation Motion in Passivated Metal Interconnects
Nicola, Lucia, Giessen, Erik Van der, Needleman, AlanVolume:
19
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2004.0158
Date:
April, 2004
File:
PDF, 1.79 MB
english, 2004