Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
Kang, Sung K., Cho, M.G., Lauro, P., Shih, Da-YuanVolume:
22
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2007.0071
Date:
March, 2007
File:
PDF, 1.70 MB
english, 2007