Study of the undercooling of Pb-free, flip-chip solder...

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Kang, Sung K., Cho, M.G., Lauro, P., Shih, Da-Yuan
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Volume:
22
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2007.0071
Date:
March, 2007
File:
PDF, 1.70 MB
english, 2007
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