Low Temperature Plasma Etching of Copper for Minimizing...

MRS Proceedings 2006 / 1 Vol. 914

Low Temperature Plasma Etching of Copper for Minimizing Size Effects in sub-100 nm Features

Kulkarni, Nagraj S, Tamirisa, Prabhakar, Levitin, Galit, Kasica, Richard J, Hess, Dennis W
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Volume:
914
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-0914-f09-08
Date:
January, 2006
File:
PDF, 170 KB
english, 2006
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