Materials Problems Affecting Reliability and Yield of Wire...

MRS Proceedings 1989 / 1 Vol. 154

Materials Problems Affecting Reliability and Yield of Wire Bonding in VLSI Devices

Harman, George G., Wilson, Charles L.
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Volume:
154
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-154-401
Date:
January, 1989
File:
PDF, 996 KB
english, 1989
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