Reactive Ion Etching of Copper with SiCl4 and CCl2F2

MRS Proceedings 1990 / 1 Vol. 201

Reactive Ion Etching of Copper with SiCl4 and CCl2F2

Howard, B. J., Wolterman, S. K., Yoo, W. J., Gittleman, B., SteinbrÜchel, CH.
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Volume:
201
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-201-129
Date:
January, 1990
File:
PDF, 1.14 MB
english, 1990
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