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Study of Electrical Properties of Defects in Soi Films by Wafer Bonding
Usami, Akira, Natori, Taichi, Ito, Akira, Ishigami, Shun-ichiro, Tokuda, Yutaka, Wada, TakaoVolume:
262
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-262-349
Date:
January, 1992
File:
PDF, 303 KB
english, 1992