Reliability Study of TiN/AlCu/TiN Interconnect in Submicron...

MRS Proceedings 1993 / 1 Vol. 309

Reliability Study of TiN/AlCu/TiN Interconnect in Submicron Cmos Process

Kuo, Arthur T., Choudhury, Ratan, Hata, William
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
309
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-309-149
Date:
January, 1993
File:
PDF, 897 KB
english, 1993
Conversion to is in progress
Conversion to is failed