Rapid Cure Of Liquid Encapsulants And Structural Adhesives...

MRS Proceedings 1996 / 1 Vol. 445

Rapid Cure Of Liquid Encapsulants And Structural Adhesives For Electronics Packaging Using Variable Frequency Microwave (Vfm) Energy

Fathi, Zak, Tucker, Denise A., Wei, Billy J., Garard, Richard S., Mead, Patricia F., Balaji, P., Hutchins, Charles L.
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Volume:
445
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-445-125
Date:
January, 1996
File:
PDF, 781 KB
english, 1996
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