Extending the Use of NO Dielectrics for DRAM by Ultrathin...

Extending the Use of NO Dielectrics for DRAM by Ultrathin Silicon Nitride RTCVD with In Situ Ammonia and Hydrogen Pre-Deposition Surface Conditioning

Tiner, Paul A., Khamankar, Rajesh B., Johnston, Clark D., Park, Song C., Pas, Michael F., Violette, Katherine E., Wise, Rick L.
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Volume:
470
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-470-387
Date:
January, 1997
File:
PDF, 1.11 MB
english, 1997
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