The Microstructure and Electromigration Performance of...

The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects

Besser, Paul R., Sanchez, John E., Field, David P., Anick, Shekhar Pram, Sahota, Kashmir
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Volume:
472
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-472-313
Date:
January, 1997
File:
PDF, 1.03 MB
english, 1997
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