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Three-Dimensional Finite Element Simulation of Electro and Stress Migration Effects in Interconnect Lines
Rzepka, Sven, Korhonen, Matt A., Weber, Eicke R., Li, Che-YuVolume:
473
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-473-329
Date:
January, 1997
File:
PDF, 3.55 MB
english, 1997