Effects of Wafer Cleaning Reduction on Metals Removal and...

MRS Proceedings 1997 / 1 Vol. 477

Effects of Wafer Cleaning Reduction on Metals Removal and Ultrathin Gate Oxide Quality

D'Emic, Christopher P., Cohen, Stephan, Zaitz, Mary Ann
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Volume:
477
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-477-233
Date:
January, 1997
File:
PDF, 470 KB
english, 1997
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