![](/img/cover-not-exists.png)
Progress on 850 nm Flip Chip Bondable VCSEL for Optical Interconnects
Cunningham, J. E., Jan, W. Y., Goossen, K. W., Krishnamoorthy, A., Walker, J. A., Tseng, B., Giaritta, G., Lothian, J., Kropf, R., Brenner, I., Sciortino, P., Chu, G., Leibenguth, R.Volume:
486
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-486-79
Date:
January, 1997
File:
PDF, 2.08 MB
english, 1997