Progress on 850 nm Flip Chip Bondable VCSEL for Optical...

MRS Proceedings 1997 / 1 Vol. 486

Progress on 850 nm Flip Chip Bondable VCSEL for Optical Interconnects

Cunningham, J. E., Jan, W. Y., Goossen, K. W., Krishnamoorthy, A., Walker, J. A., Tseng, B., Giaritta, G., Lothian, J., Kropf, R., Brenner, I., Sciortino, P., Chu, G., Leibenguth, R.
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Volume:
486
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-486-79
Date:
January, 1997
File:
PDF, 2.08 MB
english, 1997
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