Enhancement of Adhesion Between Cu Thin Film and Polyimide...

MRS Proceedings 1997 / 1 Vol. 504

Enhancement of Adhesion Between Cu Thin Film and Polyimide Modified by Ion Assisted Reaction

Choi, S. C., Kim, K. H., Jung, H-J., Whang, C. N., Koha, S. K.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
504
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-504-437
Date:
January, 1997
File:
PDF, 1.29 MB
english, 1997
Conversion to is in progress
Conversion to is failed