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Integration of Multi-Level Copper Metallization into a High Performance Sub-0.25μM Technology
Venkatraman, R., Jain, A., Farkas, J., Mendonca, J., Hamilton, G., Capasso, C., Denning, D., Simpson, C., Rogers, B., Frisa, L., Ong, T. P., Herrick, M., Kaushik, V., Gregory, R., Apen, E., Angyal, M.Volume:
514
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-514-41
Date:
January, 1998
File:
PDF, 5.02 MB
english, 1998