Direct Measurements of Thermal Stress Distributions in...

Direct Measurements of Thermal Stress Distributions in Large Die Bonds for Power Electronics

He, Jun, Shaw, M. C., Sridhar, N., Cox, B. N., Clarke, D. R.
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Volume:
515
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-515-99
Date:
January, 1998
File:
PDF, 881 KB
english, 1998
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