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Direct Measurements of Thermal Stress Distributions in Large Die Bonds for Power Electronics
He, Jun, Shaw, M. C., Sridhar, N., Cox, B. N., Clarke, D. R.Volume:
515
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-515-99
Date:
January, 1998
File:
PDF, 881 KB
english, 1998