The Mechanical Properties of Common Interlevel Dielectric...

MRS Proceedings 1999 / 1 Vol. 594

The Mechanical Properties of Common Interlevel Dielectric Films and Their Influences on Aluminum Interconnect Extrusions

Chen, Fen, Li, Baozhen, Sullivan, Timothy D., Gonzalez, Clara L., Muzzy, Christopher D., Lee, H. K., Levy, Mark D., Dashicll, Michael W., Kolodzcy, James
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Volume:
594
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-594-421
Date:
January, 1999
File:
PDF, 1.38 MB
english, 1999
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