Seed-layer Deposition for Sub 0.25 µm Cu Metallization...

MRS Proceedings 2000 / 1 Vol. 612

Seed-layer Deposition for Sub 0.25 µm Cu Metallization Using a Line Cusp Magnetron Plasma Source

Wickramanayaka, Sunil, Nagahama, Hanako, Watanabe, Eisaku, Hayashi, Toshihiko, Sato, Makoto, Nakagawa, Yukito, Hasegawa, Shinya, Mizuno, Shigeru, Numasawa, Yoichiro
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Volume:
612
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-612-d6.3.1
Date:
January, 2000
File:
PDF, 1.81 MB
english, 2000
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