Properties of Tin Thin Films Deposited by Alcvd as Barrier...

MRS Proceedings 2000 / 1 Vol. 612

Properties of Tin Thin Films Deposited by Alcvd as Barrier for Cu Metallization

Satta, Alessandra, Beyer, Gerald, Maex, Karen, Elers, Kai, Haukka, Suvi, Vantomme, A.
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Volume:
612
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-612-d6.5.1
Date:
January, 2000
File:
PDF, 301 KB
english, 2000
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