A Study on CVD TaN as a Diffusion Barrier for Cu...

MRS Proceedings 2000 / 1 Vol. 612

A Study on CVD TaN as a Diffusion Barrier for Cu Interconnects

Im, Se-Joon, Kim, Soo-Hyun, Park, Ki-Chul, Cho, Sung-Lae, Kim, Ki-Bum
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Volume:
612
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-612-d6.7.1
Date:
January, 2000
File:
PDF, 568 KB
english, 2000
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