Integrated CVD-PVD Al Plug Process for Sub-Quarter Micron Devices: Effects of Underlayer on the Via Filling and the Microstructure of the Al Film
Lee, Won-Jun, Kim, Jung Joo, Kim, Jun Ki, Park, Jin Won, Kwon, Hyug Jin, Park, Heung Lak, Rha, Sa-KyunVolume:
612
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-612-d8.1.1
Date:
January, 2000
File:
PDF, 363 KB
english, 2000