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Evolution of Surface Morphology During Cu(TMVS)(hfac) Sourced Copper CVD
Yang, Daewon, Hong, Jongwon, Cale, Timothy S.Volume:
612
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-612-d9.16.1
Date:
January, 2000
File:
PDF, 700 KB
english, 2000