Adhesion Quantification of Post-CMP Copper to Amorphous SiN...

MRS Proceedings 2000 / 1 Vol. 649

Adhesion Quantification of Post-CMP Copper to Amorphous SiN Passivation by NanoIndentation

Vella, J. B., Smith, S. M., Volinsky, A. A., Adhihetty, I. S.
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Volume:
649
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-649-q6.1
Date:
January, 2000
File:
PDF, 1.67 MB
english, 2000
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