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Effect of La on the Growth of Cu6Sn5 Intermetallic Compound for Improved Sn-Pb Solder Joints
Ma, Xin, Fang, Hongyuan, Qian, Yiyu, Yoshida, FusahitoVolume:
657
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-657-ee5.18
Date:
January, 2000
File:
PDF, 641 KB
english, 2000