Interplay Between Copper Electroplating and Chemical...

MRS Proceedings 2001 / 1 Vol. 671

Interplay Between Copper Electroplating and Chemical Mechanical Planarization

Watts, David K., Chikamori, Yusuke, Kohama, Tatsuya, Kimura, Norio, Mishima, Koji, Hongo, Akihisa
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Volume:
671
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-671-m3.1
Date:
January, 2001
File:
PDF, 152 KB
english, 2001
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