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Direct Measurement of Planarization Length for Copper Chemical Mechanical Planarization Polishing (CMP) Processes Using a Large Pattern Test Mask
Lefevre, Paul, Gonzales, Albert, Brown, Tom, Martin, Gerald, Tugbawa, Tamba, Park, Tae, Boning, Duane, Gostein, Michael, Nguyen, JohnVolume:
671
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-671-m4.4
Date:
January, 2001
File:
PDF, 167 KB
english, 2001