Implementation of a low temperature wafer bonding process for acceleration sensors
Wiemer, Maik, Otto, Thomas, Gessner, Thomas, Hiller, Karla, Kapser, Konrad, Seidel, Helmut, Bagdahn, Joerg, Petzold, MatthiasVolume:
682
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-682-n4.6
Date:
January, 2001
File:
PDF, 914 KB
english, 2001