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Microstructure and Stress Analyses of Copper Films Deposited on Biased Substrates by Microwave Plasma-Assisted Sputtering
Thièry, François, Pauleau, Yves, Arnal, Yves, Pelletier, Jacques, Ortega, LucVolume:
750
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-750-y5.28
Date:
January, 2002
File:
PDF, 144 KB
english, 2002