![](/img/cover-not-exists.png)
Palladium-free electroless deposition of pure copper film on glass substrate using hydrazine as reducing agent
Nobari, N., Behboudnia, M., Maleki, RaminLanguage:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2016.05.033
Date:
May, 2016
File:
PDF, 2.04 MB
english, 2016