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Impact of On-Chip Interconnect on the Performance of 3-D Integrated Circuits With Through Silicon Vias: Part I
Kumar, Vachan, Oh, Hanju, Zhang, Xuchen, Zheng, Li, Bakir, Muhannad S., Naeemi, AzadYear:
2016
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2016.2556709
File:
PDF, 1.78 MB
english, 2016