A Comparative Study on the Titanium Nitride (TiN) as a...

MRS Proceedings 1995 / 1 Vol. 391

A Comparative Study on the Titanium Nitride (TiN) as a Diffusion Barrier Between Al/Si and Cu/Si: Failure Mechanism and Effect of “Stuffing”

Park, Ki-Chul, Kim, Ki-Bum
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Volume:
391
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-391-211
Date:
January, 1995
File:
PDF, 2.87 MB
english, 1995
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