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Copper CMP for Dual Damascene Technology: Some Considerations on the Mechanism of Cu Removal
Wei, David, Gotkis, Yehiel, Li, Hugh, Jew, Stephen, Li, Joseph, Srivatsan, Sri, Simon, Joseph, Boyd, John M., Ramanujam, KY, Kistler, RodneyVolume:
671
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-671-m3.3
Date:
January, 2001
File:
PDF, 65 KB
english, 2001