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Effect of packing on void morphology in resin transfer molded E-glass/epoxy composites
Youssef K. Hamidi, Levent Aktas, M. Cengiz AltanVolume:
26
Year:
2005
Language:
english
Pages:
14
DOI:
10.1002/pc.20132
File:
PDF, 679 KB
english, 2005