[IEEE 2015 IEEE 17th Electronics Packaging and Technology...

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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Silicon cap structure development and microassembly for forward tactile sensing in endovascular guidewire intervention

Lim, Ruiqi, Tan, Ee Lim, Tan, Kwan Ling, Chen, Weiguo, Damalerio, Ramona, Cheng, Ming-Yuan
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Year:
2015
Language:
english
DOI:
10.1109/EPTC.2015.7412420
File:
PDF, 856 KB
english, 2015
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