![](/img/cover-not-exists.png)
Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Wymysłowski, ArturLanguage:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.03.032
Date:
April, 2016
File:
PDF, 202 KB
english, 2016