The reliability of wire bonding using Ag and Al

The reliability of wire bonding using Ag and Al

Schneider-Ramelow, Martin, Ehrhardt, Christian
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.05.009
Date:
May, 2016
File:
PDF, 919 KB
english, 2016
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