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Effects of molecular weight and molecular structure of low profile additives on the properties of bulk molding compound (BMC)
Chen-chi M. Ma, Chung-ting Hsieh, Hsu-chiang Kuan, Tsao-yang Tsai, Shih-wen YuVolume:
43
Year:
2003
Language:
english
Pages:
10
DOI:
10.1002/pen.10083
File:
PDF, 2.08 MB
english, 2003