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Effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives for microelectronic applications
Yung-Sen Lin, Sheng-Shiang ChiuVolume:
44
Year:
2004
Language:
english
Pages:
8
DOI:
10.1002/pen.20212
File:
PDF, 239 KB
english, 2004