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Dynamic dielectric analysis: Nondestructive material evaluation and cure cycle monitoring
D. Kranbuehl, S. Delos, E. Yi, J. Mayer, T. Jarvie, W. Winfree, T. HouVolume:
26
Year:
1986
Language:
english
Pages:
8
DOI:
10.1002/pen.760260503
File:
PDF, 645 KB
english, 1986