On the thermal behavior and mechanism of residual...

On the thermal behavior and mechanism of residual microstress buildup at the matrix interface in filled epoxy resins

Hong-Bing Wang, Shan-Jun Li, Tong-Yin Yu
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Volume:
33
Year:
1993
Language:
english
Pages:
6
DOI:
10.1002/pen.760330805
File:
PDF, 526 KB
english, 1993
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