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Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates
Xu, Qianye, Mei, Yunhui, Li, Xin, Lu, Guo-QuanVolume:
675
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2016.03.133
Date:
August, 2016
File:
PDF, 2.42 MB
english, 2016