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Behavior of polyamidoamine dendrimers as curing agents in bis-phenol A epoxy resin systems
Cheng Yiyun, Chen Dazhu, Fu Rongqiang, He PingshengVolume:
54
Year:
2005
Language:
english
Pages:
5
DOI:
10.1002/pi.1748
File:
PDF, 118 KB
english, 2005