[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber, De Preter, Inge, Vandersmissen, Kevin, Dictus, Dries, Di Piazza, Luca, Hou, Lin, Guerrieri, Stefano, Vakanas, George, Armini, Silvia, Daily, Robert, Lesniewska, Alicja, VandelaerYear:
2015
DOI:
10.1109/iitc-mam.2015.7325652
File:
PDF, 1.07 MB
2015