Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
Lucibello, A., Capoccia, G., Proietti, E., Marcelli, R., Margesin, B., Mulloni, V., Giacomozzi, F., Vitulli, F., Scipioni, M., Bartolucci, G.Volume:
22
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-015-2577-5
Date:
March, 2016
File:
PDF, 1.68 MB
english, 2016