Fabrication and stress analysis of annular-trench-isolated TSV
Feng, Wei, Bui, Tung Thanh, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, KatsuyaLanguage:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.05.002
Date:
May, 2016
File:
PDF, 1.94 MB
english, 2016